Department of Engineering
University of Northwestern – St. Paul
Tongyan Pan, P.E., Ph.D., is an Associate Professor of Engineering at University of Northwestern – St. Paul, USA. Dr. Pan has a BS and a MS degree from Tongji University and received his Ph.D. from University of Illinois – Urbana Champaign. Dr. Pan has a broad education background in Civil Engineering including Structural Engineering, Geotechnical Engineering, Transportation Engineering, and Construction Materials, and has developed and taught a total of 15 courses in these areas. In the research aspect, Dr. Pan has developed research concentrated on multiscale and multi-physics modeling of materials and has led and participated in 30 research projects funded by the National Science Foundation (NSF), National Cooperative Highway Research Program (NCHRP), Departments of Transportation (DOT) and other agencies of the United States. Dr. Pan served as a Principal Investigator (PI) on 10 of these projects and secured a total amount of $2M in research funding. Dr. Pan has published more than 100 peer-reviewed publications, including 60 in highly ranked journals of civil engineering and materials science. Dr. Pan has served as an associate editor for ASCE Journal of Materials in Civil Engineering and a member on the editorial boards of different journals. Dr. Pan received a First-Class S&T Progress Award from the City Government of Shanghai, China, USUCGER Research Grant (USA), Burn’s Fellowship for Young Faculty from the Catholic University of America (USA), and multiple nominations for social and professional honors. Dr. Pan has been a member on six standing committees of US Transportation Research Board (TRB) and ASCE.
Dr. Pan has research interests in general Civil Engineering including Structural Engineering, Geotechnical Engineering, Transportation Engineering, and Construction Materials. He has particular interests in the following fields:
1. Rebar Corrosion
2. Electrochemical Rehabilitation of Reinforced Concrete
3. Soil Mechanics and Modeling of Red Clay
4. Quantum Mechanics-based Materials Modeling